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RNS/RND Series Data Sheet
10 W SMT DC-DC Converters
Mechanical Data
Dimensions in mm [inches]
Surface Mount Assembly
Soldering
The following soldering instructions must be
observed to prevent failure or significant degradation
of the module performance. Power-One will not
honor any warranty claims arising from failure to
observe these instructions.
The lead-frame is constructed for a high
temperature glass filled, UL94 V-0 flame retardant,
dually ortho-phthalate molding compound commonly
used for packaging of electronics components. It
has passed NASA outgassing tests, and is certified
to MIL-M-14. The coefficient of thermal expansion is
equivalent to FR4.
The gull wing leads are formed to ensure optimal
solder joint strength and structure. Furthermore they
facilitate visual inspection (manual or automatic).
The leads are formed from a 97% Cu alloy plated
with Ni and matte Sn. This material is commonly
used
in the manufacture of integrated circuits. It has good
corrosion resistance and exhibits the nobility
inherent to all high copper alloys. Unlike brasses,
this material is essentially immune to stress
corrosion cracking. It also exhibits excellent
solderability. It is readily wetted by solders and
performs well in standard solderability tests. (Dip of
Class II or better).
The product is manufactured with a patented
process, which is fully automated, and ‘in-line’. This
ensures that there is no contamination or
mechanical stress on the lead-frame so that the co
planarity and solderability are maintained.
The product is shipped in JEDEC trays to ensure
preservation of the co-planarity and enable fully
automated assembly in the final application. Mind
the marking for pin 1!
These products are approved for forced convection
reflow soldering only. Products RoHS-compliant for
all 6 substances (model designation ending with -
M6G) allow for a solder profile with higher
temperatures; see following tables.
BCD.00038 Rev. AA, 28-Mar-2012
Page 22 of 24
www.power-one.com
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